pcb basics

from schematic to board: footprints, nets, traces, copper zones. keep power clean, returns short, and labels helpful.

workflow

finish the schematic; run electrical rules check.
assign footprints that match your parts.
place by function (power, brain, I/O). keep decouplers right at IC pins.
route short & direct signals first; widen power traces.
add ground pour; stitch with vias.

fact

a ground pour / plane is a large copper area connected to GND. it shortens return paths, reduces noise, and helps thermal.

caution

keep high-current returns away from sensitive analog returns; stitch pours with vias; keep clearances sensible.

why it’s good

Short, low-impedance return paths → less noise/EMI and cleaner signals.
Shielding and heat spreading.
Simpler routing (you don’t need a separate ground trace everywhere).

how to add it (2-layer)

Create a copper zone in your PCB tool and set its net = GND (do it on top and bottom).
Fill the zone; enable “remove islands/orphans.”
Stitch with vias—sprinkle GND vias around the board, at edges, and near high-current/fast loops.
Keep the plane as continuous as possible; avoid big slots that force return currents to detour.
Use thermal reliefs on through-hole pads so they solder easily.

gotchas

Don’t route traces that split the plane between a signal and its return.
Give extra clearance near high-voltage, crystals/antennas, or sensitive analog as needed.

rules of thumb

trace width: 6–10 mil for signals; larger for power (use a calculator if >300 mA).
clearances: 6–8 mil is fab-friendly; USB-C & high-voltage need more care.
silkscreen: mark orientation (pin-1 dots, diode bars), test pads, and labels.

manufacture

export gerbers + drill files from your EDA (KiCad, EasyEDA, etc.).
common defaults: 1.6 mm thickness, 1 oz copper, lead-free HASL or ENIG.